Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Overview: JavaScript updates in 2026 focus on fixing long-standing issues instead of adding unnecessary complexity.Core ...
Abstract: In this article, a novel design method for wide-angle beam-scanning phased arrays is investigated. Different from the traditional method that focuses on widebeam antenna element, this novel ...
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