Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...

Ironwood Electronics has recently introduced a new BGA socket design using high-performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2086 socket is ...